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Beilstein J. Nanotechnol. 2014, 5, 258–267, doi:10.3762/bjnano.5.28
Figure 1: (a) Mechanism of Cu-UPD onto a BP2-modified Au(111) surface with the deposition starting at defects...
Figure 2: Cu-UPD on Au templated by a patterned BP2 SAM. a) Large scale STM image of the surface before depos...
Figure 3: Temporal evolution of Cu-UPD. (a) Large scale ambient STM image of a native BP2 SAM on Au. (b) Magn...
Figure 4: Templated Cu-UPD illustrating tolerance of the process against substrate dislocations. (a) Native s...
Figure 5: Sequence of STM images showing the UPD-based conversion of a BP2 SAM into a patterned binary SAM of...
Beilstein J. Nanotechnol. 2012, 3, 101–113, doi:10.3762/bjnano.3.11
Figure 1: (a) Scheme of SAM controlled electrodeposition and lift-off of metal structures. Starting from a un...
Figure 2: (a) Illustration of different types of defects in a SAM. Domain boundaries (1) and substrate steps ...
Figure 3: Linear-sweep voltammograms comparing the electrodeposition of Cu on clean (black squares) and SAM m...
Figure 4: (a,b) Chronoamperograms of single potential (a) and double potential (b) deposition processes on a ...
Figure 5: SEM images of Cu nucleation and growth on a MBP0-SAM on Au/Ag/Mica prepared at 65 °C for 24 h. (a) ...
Figure 6: Electrochemical deposition of Cu on e-beam-patterned MBP0-SAM/Au/Si. (a) SEM image of a series of p...
Figure 7: SEM images of a SAM templated copper deposit on the original MBP0 coated Au/Si substrate (a) and af...
Figure 8: AFM topography images of Cu electrodeposited onto an e-beam-patterned MBP0-SAM on Au/Si (a) before ...
Figure 9: AFM images of Cu electrodeposition onto a MBP0/Au/Si sample demonstrating the quality of passivatio...
Figure 10: (a,b) AFM topography images and height profiles along the lines indicated, comparing the roughness ...